Overview

At Centum, state of the art technology is used to provide the customer with products that are exemplary in quality and performance. Extensive experience in the production of High Mix Low-Medium Volume products in high technology areas distinguishes our service offering. Our manufacturing ability includes a gamut of capabilities that covers a broad spectrum of electronics manufacturing.

Manufacturing Capabilities

  • Multiple SMT Lines including both Single and Double Sided
  • PBGA (PITCH BALL GRID ARRAY) and FBGA (FINE BALL GRADE ARRAY) to 0.5mm
  • Chip-on-Board / Wire Bond / Chip on chip
  • Through Hole & SMT Mixed
  • Through Hole to SMT Conversion
  • Leadless Chip
  • Fine Pitch (0201 & 01005)
  • Multi Chip Modules
  • Conformal Coating- Automated and manual
  • Thick / Thin Film
  • Rapid Prototyping
  • HMLV (high-mix low-medium-volume)
  • Overflow Assembly
  • Box Build / Final Assembly
  • In-Circuit & Functional Testing
  • BGA Rework

Certified Test & Screening Facility

  • He / FC Bombing
  • Internal / External Visual Inspection
  • Fine & Gross Leak Testers
  • Temperature Cycling (-65 to 200 deg C)
  • Constant Acceleration
  • Liquid Thermal Shock
  • Thermal Humidity Bias Test
  • Burn In Chambers
  • 3.5 Ton Vibration
  • Thermal Vacuum Chamber

Test Capabilities

  • Flying Probe Tester (Takaya) –
  • X-Ray & BGA Rework Stations –
  • Automatic Optical Inspection
  • High Voltage & Insulation Testing
  • Environmental Stress & Screening (ESS)
  • Functional Test Design, Development, Management
  • Diagnostic Test
  • Firmware Test
  • System Test
  • Calibration
  • NI & Agilent based
  • Reverse engineering

Test Capabilities


Group of Companies

Location

No: 44, KHB Industrial Area,
Yelahanka New Town,
Bangalore - 560 106
India

Tel: +91 80 30046000
Fax: +91 80 30046005

Email: sales@centumelectronics.com
HR Enquiries: HR@centumelectronics.com

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